on Thursday, IBM unveilied their design for an internally-cooled computer chips. The new chips have thousands of tiny water passages that run between the chips layers. Each tube is only 50 microns in diameter, and is hermetically sealed using silicon walls and solicon oxide around each connection between tubes. At only 10 microns, the seals require fabrication accuracy almost 10x more precise then is required for current computer chips. The entire chip sits in a silicon cooling container, with water pumped through the chip, in one side and out the other. IBM says that the technology could become commonplace in consumer products within five years.

(Graphic from link)

http://www.electronista.com/articles/08/06/06/ibm.shows.water.cooled.cpu/